Damage-Free Dicing of SiC Wafers by
Water-Jet-Guided Laser
Synova SA, Ch. de la Dent-d’Oche, CH-1024 Ecublens,
Since several years, the water-jet-guided
laser technology has been used for a wide range of precision applications,
including wafer dicing. It has proven its capacities to process not only
silicon, but also more brittle semiconductor materials such as GaAs or low-k
wafers. It has recently been tested on another compound material, which is
known for its hardness: SiC. Compared to abrasive sawing, the water-jet-guided
laser offers higher speed for the same quality at reduced running costs, as
there is no blade wear.