Reliability Study of MIM Capacitor Built On Top of Backside Via In
Northrop Grumman Space Technology
We report a compact and reliable MIMCAP directly on backside through via (MIMCAP-On-Via). The potential performance effects of a capacitor on backside via is explored with changing via density and the total number of vias. The MIMCAP-On-Via reliability was verified using a time dependant dielectric breakdown mode, and its reliability is comparable to a conventional MIMCAP. The thermal stability of epoxy mounted MIMCAP-On-Via test structures was also verified over the -55˚C to 125˚C temperature range with no failures.